Used MIRAE MX 400 #293670604 for sale

MIRAE MX 400 is a leading pc board assembly and manufacturing equipment. The system combines multiple processes, including automated optical inspection (AOI), solder paste printing (SPP), surface mount technology (SMT), pin-in-paste (PiP), along with two back-end processes of reflow soldering and component placement. This combined approach allows users to quickly and efficiently produce quality electronic components at higher yields than other comparable systems. The SPP process within MIRAE MX400 is a highly efficient process as it uses proprietary fluxing nozzles with adjustable pump settings to disperse an accurate amount of flux and adhesives onto the surface mount components with precision. The fluxing unit also works to adhere and moisten the components which helps in the SMT process. The SMT process then drives components to their exact area of placement with absolute precision. The placement time for each component is minimized due to the high-speed placement head that uses a three-axis travel machine for increased accuracy and quick placement. The integrated AOI process then checks the placement of components and ensures that the placement of components is accurate. If the placement is not accurate, the tool then quick correction instructions are sent directly to the process controller to make sure that no errors occur in the assembly process. After assembly, MX 400 then activates the reflow soldering process which is used to ensure that all components are appropriately soldered with precision. The reflow process utilizes a profile optimizer program which helps to maintain a constant temperature profile in order to efficiently and accurately solder all components in the PCB. The thermal profile optimizer asset also ensures that the solder joint strength is maintained which is critical for long-term operation of the device. Finally, the PIp process within MX400 helps improve the lead-free soldering process within the device. This process helps to quickly and accurately apply solder paste under the components, allowing for easy removal during assembly and providing a strong mechanical bond for greater end products reliability. With MIRAE MX 400 pc board assembly and manufacturing model, manufacturers are able to quickly and efficiently produce circuits with reliability within a matter of minutes. This highly efficient, modular equipment combined with integrated processes ensures that consumers and producers are getting the highest quality end products in the market.