Used MIRAE MX110P #159768 for sale

MIRAE MX110P
ID: 159768
Vintage: 2008
Chip mounter Specifications: 8,000 CPH/QFP (2,400 CPH) (4) heads + (1) precision head Board size: 410 x 460 x 5.0mm Component size: 0603mm to 50mm 2008 vintage.
MIRAE MX110P is a versatile pc board assembly and manufacturing equipment designed to meet the needs of modern SMT production. This high-precision system is capable of producing top-level printed circuit boards in a fraction of the time required for traditional hand-mounted SMT production. MX110P provides comprehensive PC board assembly capabilities. It is equipped with an auto rail magazine that is capable of loading up to 20 PCB assemblies at a time, ensuring high levels of efficiency. Additionally, the programmable feeders allow for precise coordination between the board and components, with accurate positioning being accomplished in as little as 1.5 seconds. MIRAE MX110P also features advanced pick and placement with a vision unit that utilizes an imaging sensor to analyze and ensure precise placement of components. This machine is equipped with a dual arm gantry and a high-speed capture tool, enabling flexible production of SMT components in a wide variety of sizes, shapes and colors. Moreover, MX110P can be adjusted to accommodate different types of boards, including Printed Circuit Board (PCB), Shrink Ductor (SD) and Laminar Systems (LS). MIRAE MX110P is powered by a powerful and user-friendly PC software package, providing operators with the ability to monitor and control the entire assembly process from a single window. Powerful features such as line selection, speed management, tool settings and auto rail detection, allow for accurate and efficient manufacturing of PCBs. In addition to its impressive assembly capabilities, MX110P also offers a wide range of soldering options, including wave soldering, wave tinning and dip soldering. The wave soldering asset utilizes a wave or linear soldering machine to carry out the soldering process. Wave tinning can be used to add additional solder to components after they have been wave soldered. Finally, the dip soldering model provides a reliable and accurate spot welding process, ensuring that all components are securely attached to the board. Overall, MIRAE MX110P is a powerful and efficient equipment that can significantly increase the speed and precision of your production process. By providing both comprehensive assembly capabilities and a range of soldering options, this system is the perfect solution for producing top-level printed circuit boards in a fraction of the time.
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