Used MIRTEC MV-3L #293671792 for sale

MIRTEC MV-3L
ID: 293671792
Vintage: 2014
2D Automatic Optical Inspection (AOI) system 2014 vintage.
MIRTEC MV-3L is a state-of-the-art PC Board Assembly and Manufacturing Equipment from the renowned Japanese Automation Equipment Manufacturers MIRTEC. This modular system is designed for high-end production with a 3D-vision-based optical assembly unit for PCBs. The machine offers high precision placement with 0.02mm accuracy, and an accuracy variation of 0.03 mm. The tool is equipped with a wide range of component detection solutions, including 3D top-view, side-view, and the unique High-Resolution Super Compound Eye (RSC-Eye) asset. The integrated conveying model with round table mechanism allows for efficient and accurate placement of components up to 0603 and high-density packages; while the In-line (Linear) and the renowned Orthogonal Placement systems are designed to enhance the equipment's production performance. The 3D-vision based component recognition system features Bright LED light sources that produce high contrast images and enhance the recognition accuracy. It also has advanced I/O automation capabilities with a 19-inch touch-screen Human Machine Interface (HMI) for easy operator interface. The unit is embedded with an intelligent omni-directional vision-based advanced defect detection machine with more than 40 different defect signatures that detect defects such as non-conformities in component placement and missing components. The tool also has other integrated features like Auto-Component Change (ACC) and Auto-Pattern Change (APC) systems for enabling fast and efficient job changes. MIRTEC MV 3 L also offers high throughput reliability from its advanced 3-step Vision Based Inspection-Advance (VBIA) asset with a real-time OCR-recognition feeder and accurate image inspection. Besides, its integrated X-ray inspection model offers enhanced defect detection and provides flexibility in board material selection. MV-3L also offers detection and recognition accuracy for high-end packages, including mini BGA packages, and can support multiple substrate types such as FR-4, FR-4-HT, BT-2k, etc. With its enhanced flexible feeder and nozzle systems, it allows for efficient production scalability. This equipment also utilizes advanced Intelligent Placement Software (IPS) and Real-Time Software (RTS) algorithms for optimizing the placement speed with minimized cycle times. Overall, MV 3 L PC Board Assembly and Manufacturing System is a reliable, efficient, and cost-effective automation equipment for PCBs. It features an accurate detection and placement unit, high-resolution vision-based component recognition, and defect detection which makes it a perfect choice for any production application.
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