Used MIRTEC MV-3L #9133114 for sale

MIRTEC MV-3L is a state-of-the-art PC Board assembly and manufacturing equipment. It is specifically designed to provide precise assembly and testing of PCBs. It includes a range of advanced features to ensure both high quality and efficiency. The system consists of a high-speed, multi-motion placement platform, an optical vision unit, and a variety of feeders that are reconfigurable into multiple types of placement heads. Additionally, an integrated Opto Defect Imaging Detector is available for detects surface interruptions on the PCB and inspects the condition after the soldering process. The placement platforms are designed to achieve up to 20,000 cph with component placement accuracy down to +/- 25 microns. An integrated dual-camera, in-line chipshoot vision machine ensures continuous and accurate component pick-up and placement. The cameras provide a crisp image of components on the belt and component, enabling placement accuracy that exceeds industry standards. Furthermore, the chipshoot design ensures continuous movement of components on the belt, decreasing the cycle time of the machine for higher throughput. The tool has a vision head selection enabling user-friendly changeover when using different types, sizes, and shapes of components. Feeders are reconfigurable for various sizes and shapes of components through a variety of integrated tools. With the integrated single-level head design, boards can be moved quickly, accurately, and smoothly while allowing the PC Board assembly process to reach maximum throughput. On the inspection side, MIRTEC MV 3 L has a 2 Series DE-300 8kHz X-Y Scanning Defect Inspection Asset. This model has a high sensitivity of detecting false contact, contact failures, insulation leakage, and various types of defects in surface-mounted components. A PCB memory can be used for saving data as well as the capability to download data or save PC board images. In summary, MV-3L is an advanced PC Board assembly and manufacturing equipment designed specifically for precise component placement and efficient PCB assembly. It features a high-speed, multi-motion placement platform as well as an integrated vision system and various reconfigurable feeders. Additionally, an integrated Opto Defect Imaging Detector is available to detect and inspect conditions after the soldering process. An integrated dual-camera, in-line chipshoot vision unit is also available to enable accurate component pick-up and placement. Finally, an 8kHz X-Y Scanning Defect Inspection Machine can be incorporated for detecting various types of defects in surface-mounted components.