Used NEMETH 300 #9011555 for sale

ID: 9011555
RF Preheater RF output power up to 5-kilowatts Preheating capability of up to 3-pounds per minute (typical resins) Operates at a nominal frequency of 80-Mhz Top electrode measures 12” X 12” Spacing between electrodes is adjustable from 1.5” to 5.5” Solid state silicone diode full wave bridge rectifier assembly Automatic pneumatically operated hood with safety bar Circuit breakers for control power and high voltage Shielded RF enclosure Configured to operate on 240-volts 3-phase 60-hertz line voltage.
NEMETH 300 is a three-stage pc board assembly and manufacturing equipment designed for both mid to large-scale assembly operations. The system is comprised of a pre-heating plate, a high-speed reader, a board cleaner, a vision unit, a dispenser, a component positioner and a selective soldering machine. The pre-heating plate is designed to provide an ideal environment for the soldering process. It consists of a lower and upper heating stage that provides thermal stability and extends the process time window. This helps to minimise oxidation and ensure product quality. The high-speed reader is used to verify the presence and orientation of components. It includes a powerful processor providing a considerable speed advantage over other non-high speed readers. The board cleaner is used to remove debris, oxidation and other contaminants from the board before the soldering process. This ensures that the solder joint is clean and able to form a strong bond. The vision machine is used to ensure the correct positioning of components on the board. It is made up of two high-definition video camera sensors that scan the board in real-time to check for components that are not in their correct position. The dispenser is able to measure out precise quantities of flux, solder paste and other fluids that are required for the soldering process. This helps to ensure consistent results and lower production costs. The component positioner is designed to place components on the board securely and accurately. It includes a two-axis motorised positioner that helps to reduce the risk of damaged components. Finally, the selective soldering machine is used to join components to the board. It uses a combination of surface tension and heat to form a strong bond that is resistant to shock and vibration. The selective soldering machine also features a dual valve soldering head for added reliability. Overall, 300 is an advanced pc board assembly and manufacturing tool that is designed to meet the needs of mid to large-scale assembly operations. The asset is capable of providing consistent results and offers a number of features that help to reduce production costs and minimise the risk of errors.
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