Used OMRON VP5000 SPI #9128955 for sale

OMRON VP5000 SPI is a pc board assembly and manufacturing system designed to reduce the cost and time associated with printed circuit board assembly (PCBA) manufacturing. VP5000 SPI feature a combination of laser direct imaging (LDI), solder paste inspection (SPI) and 3D solder paste inspection (3D-SPI) to ensure the highest quality printed circuit boards are produced. It is designed to provide a rapid, repeatable, and cost-effective method of producing PCBs. Starting with LDI, OMRON VP5000 SPI allows for direct imaging of the printed circuit boards right onto the substrate. The laser penetrates the board's coating and builds up the images directly onto the board without the need for physical masks. The LDI process is repeatable and highly reliable, providing the highest accuracy and yields for PCBAs. The next step in assembly is the SPI process. Watching over the placement of solder paste, VP5000 SPI inspection systems provide comprehensive monitoring of all paste application areas. It tracks every paste feature and inspects for deficiencies in paste volume, shape and proper placement. This data is reported with the precision required for modern PCB assemblies. The last process is the 3D-SPI. By effectively testing each pad and component separately, it can detect solder bridging and insufficient solder deposition as well as be used to evaluate component coplanarity and the presence of component solders. This gives OMRON VP5000 SPI inspection sys a 3 dimensional view of the final profile of the board and components before it is sent for additional process. Overall, VP5000 SPI provides an efficient solution for assembling printed circuit boards. By combining LDI, SPI and 3D-SPI, it is able to effectively monitor board and component assembly with great accuracy and repeatability. Its automated process ensures that defects are eliminated while simultaneously reducing the costs and timeframe associated with PCBA manufacturing.