Used PARMI SPI HS60 #9371991 for sale

PARMI SPI HS60 is a board assembly and manufacturing equipment, intended to enable increased manufacturing throughput and overall quality. It utilizes a high-speed automated platform, with both print-in-place and conventional print technology. The machine utilizes innovative digital computer vision and high-speed print frame technology for greater accuracy and better board quality. The spindle rotates at up to 60,000 RPM to apply precisely controlled glue patterns to the board, and the print-in-place system allows for the direct application of solder paste to the board. The unit supports most standard component packages, including fine-pitched BGAs, QFPs, and over 30 other package types. The robust vision algorithms and high-resolution imaging systems accurately match components to the components pads with low tolerance levels. The machine is capable of supporting boards measuring up to 610mm in length, and features a mechanism that allows for fine-grain control of correct component placement and board alignment. This further ensures accuracy and consistent quality. The automated nature of the tool helps to improve throughput without sacrificing quality. The motion control works in tandem with the vision components to deliver fast, accurate placement. The device is upgradable and supports multiple vision modes and customized programming to help tailor it for different products types. Overall, PARMI SPI HS 60 helps to reduce downtime, minimize human error, improve quality, and reduce waste, all while maximizing throughput. It provides an ideal solution for robust and reliable board assemblies.