Used PDR IR XT5P Pro #110069 for sale
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ID: 110069
Vintage: 2008
SMT / BGA Rework system
Specifications:
Advanced focused IR component heating:
150W
Focused IR heating with adjustable image system
Quartz IR PCB preheating:
High power
Medium wave quartz IR
1600W, or 2000W
(2) Zones: 2 x 800 or 1000W Switchable
PDR Lens attachments:
F700 (Ø25 - 70mm spot size) standard
Advanced professional vacuum placement system
Precision macro-micro X / Y / Theta PCB table
Component temperature sensing:
Non-contact
IR Sensor
PCB Temperature sensing
Auto profile process control:
With PDR thermoactive software suite
CCTV Prism based BGA/uBGA alignment system
Auxiliary process observation camera
Bench top requirements:
Top heat power: 150W IR
Back heater power: 1600W or 2000W IR
Voltage / Frequency:
220-240 Volts
50 / 60 Hz
2.4 Kw
Basic setup with vision: Prism based BGA alignment with LED lighting
Focused IR lens system
F700 Lens attachment
2000w - 4 x 500w - 240mm x 240mm: Quartz IR (220/240v only)
Advanced professional placement system (Y/Z axis, rotation and soft landing)
Type 5: Digital controller with V4 thermoactive software control
C-Type precision IR sensor
Simple K-type wire thermocouple
Component nest
SP06011 Spring XY board support assembly
AC01005 White tape
ESD Grounding point
Options:
Upgrades:
UGPCBH2:
1600w: 240 x 240 mm Quartz IR (220/240V only)
UGTS11:
Temperature sensing: Component (T/C 1) KE-type precision IR sensor
UGTS21:
Temperature sensing: PCB (T/C 2) PDR Pro K-type contact probe
UGTS22:
Temperature sensing: PCB (T/C 2) C-Type precision IR sensor
UGTS23: Temperature sensing: PCB (T/C 2) KE-Type precision IR sensor
UGSFPA2: Component print frame
UGSFPA3: Mini stencil paste head
Extras:
SP01015: Auxillary process observation camera
AC-F150: F150 Lens attachment
AC-F200: F200 Lens attachment
AC-F700: F400 Lens attachment
Downgrades:
DGCH2: Professional vacuum placement system (Z-axis and rotation)
2008 vintage.
PDR IR XT5P Pro is a custom printed circuit board (PCB) assembly and manufacturing equipment designed for a wide range of applications. The system features a powerful, modular design that is scalable to your exact needs. The entire unit is composed of multiple subsystems which include the main controller, conveyer track machine, automated surface-mount assembly, component placement and measurement systems, component placement vision tool, reflow oven and Post-Assembly Thermal Stress Asset. The controller of IR XT5P Pro is an industrial standard PC, featuring an Intel Core I7 processor and Windows 10 OS. The controller supports several PCBs, such as HDI, RF and High-Power, and can be configured to mount components along with component placement vision model specifically optimized for each type of component. The conveyer track equipment enables a smooth and efficient flow during the process, allowing a large number of PCBs to be handled at once with minimal downtime. The automated surface-mount assembly system is the most complex part of the unit. It is equipped with PDR-IRPlacer, an innovative component placement technology, for accurate orientation and placement of all SMD components. The machine can be programmed with the CAD files to increase reliability and reduce the risk of an error during assembly. Furthermore, it offers a wide range of component placement options to achieve the highest level of accuracy and speed. PDR IR XT5P Pro also comes with the component placement measurement tool and feature a PDR-IR VisionPlus Vision Asset. This model uses the CCD camera to optically inspect the surface and detect components accurately, making sure the entire PCB assembly is of the highest possible quality. It also offers the possibility of 3D component measurement, further reducing the risk of errors. The reflow oven heats and melts all the necessary components onto the PCB with minimal thermal stress, resulting in reliable assemblies. It is fitted with PSR (preventive over temperature equipment, a dust-free chamber, and a thermal gradient measuring system, making sure that all components are properly hardened without going over the temperature thresholds. Lastly, the post-assembly thermal stress unit is designed to identify mechanical weaknesses or mismeasurements in the assemblies, lowering the risk of any unexpected failure. It can simulate a wide range of environmental conditions, allowing you to test and verify successful components before shipping. All in all, IR XT5P Pro will enable you to benefit from the most advanced machine for PCB assembly and manufacturing. It's powerful, flexible and easy to use, featuring the latest technologies and offering the highest level of accuracy, reliability and speed.
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