Used PHILIPS / ASSEMBLEON FCM #9032340 for sale
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ID: 9032340
Vintage: 2010
Pick and place machine
Model no. PA1100/04
Base II
2010 vintage.
PHILIPS / ASSEMBLEON FCM is a versatile and intuitive pc board assembly and manufacturing equipment for SMT production lines. The system boasts the latest in assembly technology, providing users with high yields, short cycle times, and superior product quality. The unit allows for inline, modular, size-driven, and mixed-model product manufacturing, with each mode having its own unique specifications and functionalities. The machine also features a large range of placement accuracy, user-friendly HMI displays, a wide variety of application-specific nozzles, and online data analysis. Additionally, the tool can be networked with other PHILIPS systems for increased throughput. The asset sports a reliable, expandable placement architecture with dedicated placement lanes, and a 12-zone tool changer with a 3-point mount for quick and easy tool changes. The placement model is capable of placing components from 0201s to PP10s with accuracies of up to 50 microns. One of the equipment's most impressive features is its standing multi-angle vision system. This allows the unit to perform high accuracy placement inspections of both 0201s and larger components of up to PP12s. Additionally, the machine features a range of advanced vision algorithms and a laser centering device for improved inspection accuracy. The tool also allows for the expansion of stencil-printer capacity with the addition of an inline printer. The printer can print onto both sides of the board simultaneously, and features a 68 x 65 inch board carrier with a 3D digital camera that is capable of inspecting boards up to 50mm thick. The printer also features an integrated solder paste test machine for real time uniformity monitoring of the solder. Finally, the asset is equipped with an intelligent flow soldering process. This allows for the soldering of fine-pitch components, while simultaneously performing a wide range of soldering criteria such as short-term pressure sensing, lid covering, and PCB board warpage inspection. This provides users with an increased level of accuracy and greater solder reliability. Overall, PHILIPS FCM provides users with an advanced and highly integrated model for pc board assembly and manufacturing. By utilizing the equipment's core technologies, users can achieve superior yields, short cycle times, and a greater level of product quality.
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