Used PHILIPS Topaz #9071912 for sale

PHILIPS Topaz is a PC board assembly and manufacturing equipment designed to provide precise, efficient, and enhanced performance for Printed Circuit Board (PCB) assembly. The system is built by combining various components to form a comprehensive production line for all types of PCB assemblies. The components include: Pick and Place Unit, Automated Optical Inspection (AOI), Solder Paste Stencil Process, Reflow Oven, Wave Soldering, Hand Soldering and Direct Soldering, Testing, X-ray, Cleaning, RoHS compliance. Topaz Pick and Place Machine is designed to accurately place components onto the PCB's. The components are placed precisely via the advanced placement tool with its high-quality component mounter and component placement capabilities. The asset can automatically detect and adjust for component orientation, placement accuracy, and component sizes up to 0.4mm. In addition, the component mounter features flexible feeder and component deck configurations to accommodate various component sizes, types and shapes. The Automated Optical Inspection (AOI) component of the model provides automated optical inspection of a variety of component types. The AOI can detect component misalignments and component incorrectly placed or missing components. In addition, the equipment is optimized for automated adjustment and calibration of component placements to ensure all component placements are done correctly and consistently. The Solder Paste Stencil Process component is designed to accurately deposit solder paste onto the PCB's. The system utilizes a high performance stencil printer which is optimized for fast and accurate printing, resulting in high quality component soldering and assembly. The Reflow Oven component is designed to precisely heat and cool PCB's in order to properly activate the solder paste. This component is optimized to provide consistent temperature conditions, eliminating potential defects due to thermal shock. The Wave Soldering component is designed to accurately and consistently solder components onto the PCB's. The unit is designed to dispense flux, activate soldering on the PCB's, and to provide wave soldering control to ensure high quality soldering and assembly. The Hand Soldering and the Direct Soldering components are used for soldering of various components on a PCB. The hand soldering component can easily and reliably solder components onto the boards, while the direct soldering component is used for soldering of various components onto connectors or in panelizations that require soldering on both sides. The Testing component is designed to detect failures, shorts, and opens on a printed circuit board. The machine can detect and generate data logs for testing trace continuity, component excursion, insertion test, thermal stress tolerances, ESD protection, and many other tests. The X-Ray component is used to detect hidden defects and angles of components that are otherwise difficult to detect. This component ensures the highest level of quality and accuracy. The Cleaning component is designed to clean and remove residue on PCBs. The cleaning is automated and performed with precision to ensure all working surfaces are free of contaminants. The RoHS compliance component is designed to support compliance with European RoHS Directive. The tool is designed to ensure all components and materials chosen meet the requirements of the RoHS Directive. Overall, PHILIPS Topaz is an advanced asset that provides increased productivity, cost savings, and improved accuracy and quality for PCB assembly operations. By using the combination of activities, processes, components, and features provided by this model, companies can easily meet their production goals and competitive requirements for PCB assembly operations.