Used SAMSUNG CP-45FV NEO #9089733 for sale

SAMSUNG CP-45FV NEO is an ideal solution for companies that specialize in PC board assembly and manufacturing. This cost-effective board manufacturing equipment offers superior capabilities for component placement, solder paste printing, and reflow soldering. SAMSUNG CP45FV NEO features a placement head equipped with two 12-nozzle heads for precise component placement at speeds of up to 34,000 CPH. With a vision system to detect component size and radii, it ensures high placement accuracy and stability. Additionally, the unit features Anti-Static features for components and a protrusion detection for stencils. CP-45FV NEO's solder paste printer is equipped with six 5.5" x 9.2" heated print heads capable of printing up to 9,000 cph per head, and a PCB size of up to 21.26" x 17.32". The printer utilizes a high-precision vision machine for precise substrate registration, making sure the solder paste is applied in the exact locations required. CP45FV NEO's convection reflow soldering oven provides a high degree of vertical temperature uniformity, for consistent reflow of components. The PCB is automatically moved during heating/cooling, and the oven also features oxidant scrubbing, allowing for quick repair. The temperature and environment settings can be adjusted on the touch panel, allowing for customized reflow profiles. SAMSUNG CP-45FV NEO has three optional components to enhance its manufacturing capabilities: the Ceramic BGA Module, for quick ceramic-type components handling; the Double Print Module, for high-precision print of small chip parts; and the Independent OS Module, for applications that require dual processing. SAMSUNG CP45FV NEO isalso equipped with various safety features, including an emergency stop button, a door interlock tool and an enclosure for safe operation. In conclusion, CP-45FV NEO is a highly advanced board manufacturing asset that offers versatile, quick and cost-effective solutions for PC board assembly and manufacturing. Its components placement, solder paste printing, and reflow soldering capabilities are precise and efficient, creating a reliable and cost-effective solution.