Used SAMSUNG CP60HP #9202648 for sale

SAMSUNG CP60HP
ID: 9202648
Chip mounter.
SAMSUNG CP60HP is a pc board assembly and manufacturing equipment designed for highly accurate component placement in a fraction of the time compared to other conventional machines. Its lightweight and compact body provides users with maximum flexibility and easy installation on even the most confined production floors. CP60HP offers many features that are unique to the assembly process. Its dual-tape placement system allows for higher production rates and more efficient production by simultaneously handling both high-density components and ICs. The Vision Alignment Unit (VAS) utilizes two high-speed cameras to detect and identify components in order to accurately place components on the board within 0.1mm accuracy. This machine also features an intuitive human machine interface (HMI) with a visual user interface, making it easy to understand and operate. SAMSUNG CP60HP is designed with high-speed jetting nozzles that ensure hot air in less than a second when soldering, allowing for superior soldering on a variety of board substrates. High-speed jetting can also be used in conjunction with CP60HP's high-speed component recognition tool, allowing for the identification and placement of components, even if the components are incorrectly aligned on the board. SAMSUNG CP60HP also offers a Jet Assisted Solder Dispensing (JASD) asset that is designed specifically for precision placement in hard-to-reach areas where manual soldering is difficult. This model allows for controllable, accurate and safe solder operations on acrylic-spread components and lead-free solder components. Equipped with multiple placement systems, CP60HP is capable of single-pass assembly, providing the highest production rates with the most accuracy. Its automated component identification equipment allows for the recognition of parts, making parts that are not in the setup data set part of the board assembly. It also features an optimized component-picking algorithm, minimizing placement time and eliminating component recognition errors. SAMSUNG CP60HP provides features that lead to improved quality and lower inconsistencies in the production process. Its total 3D performance measures the gap between a board and a component, allowing for accurate placement of components after inspection using X-Y laser sensors. Additionally, its defect inspection system detects dry joints, open circuit, and wrong component placement, allowing for prompt corrective action. Overall, CP60HP offers users a reliable and versatile pc board assembly and manufacturing unit with high consistency and accuracy. It features high-speed jetting and automation, a vision alignment machine, a jet assisted solder dispensing tool, an automated component identification asset, and a defect inspection model. With its range of features, SAMSUNG CP60HP is suitable for various applications, and is sure to offer users the benefits of reliability, efficiency, and quality.
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