Used SAMSUNG Excen Pro #9397378 for sale

SAMSUNG Excen Pro is a fully-automated pick and place, assembly, and meso-level testing equipment for Printed Circuit Board (PCB) assembly and manufacturing. The system is designed to quickly and efficiently support rapid prototyping, small production runs and process optimization applications. It is an ideal solution for industries that require high-speed, high quality PCB assemblies. Excen Pro consists of six main components: 1. A high-speed surface mount placement head that can place components accurately and quickly. Components can be clipped or vacuum-picked with the placement head. 2. A vacuum pump providing vacuum suction on the placement head and vision unit. 3. An advanced vision machine to verify component placement. 4. Automated board feeding, handling and removal. 5. Meso-level testing systems of built-in components to minimize waste and increase reliability. 6. An offline programming station to enable efficient and effective programming and customization. SAMSUNG Excen Pro uses high-speed placement and vision systems to accurately place components on the board in the correct location and orientation. The placement head can be programmed to perform a variety of tasks and the vision tool ensures that components are accurately positioned. The asset can quickly process multiple PCBs simultaneously and can be programmed for selective component placement. The meso-level testing model helps to minimize waste by analyzing components in real-time and alerting operators of any component failures before they become costly replacements. This helps to reduce product defect rates. The offline programming station allows for efficient programming and customization of components, features and functions. Excen Pro is a reliable, high-speed equipment for PCB assembly and manufacturing that can reduce production time and costs while maintaining high levels of accuracy and quality. The system's advanced features, such as component testing, component placement programming and component arrangement flexibility, help ensure a cost-effective and efficient PCB assembly process.