Used SAMSUNG SP-400 II #9032617 for sale

ID: 9032617
Machine, 2005 vintage.
SAMSUNG SP-400 II is a state-of-the-art PC board assembly and manufacturing equipment designed to streamline the process of PC board fabrication with features that can handle a wide range of board thicknesses and sizes. SP-400 II is capable of handling board thicknesses from 0.4mm to 3.2mm and board sizes up to 600mm x 400mm. The system includes a number of features that make it an ideal solution for modern PC board production. The unit's double-sided optical alignment machine with its built-in auto-alignment tool ensures accurate component placement on each side of the board. The optical alignment asset also allows up to four different component alignments, enabling the model to process a variety of board sizes. SAMSUNG SP-400 II also features a highly accurate component pick-and-place arm to transfer components to the board with pinpoint accuracy. SP-400 II's temperature-controlled atmosphere ensures regulation of reflow solder temperatures, creating a stable and reliable solder joint. The equipment also features a high-speed soldering head for rapid soldering of components onto the board. The board travel system on SAMSUNG SP-400 II enables the unit to process multiple boards at once with a high degree of efficiency. The PC board assembly and manufacturing process is facilitated by SP-400 II's software, which is integrated into the machine and enables programming of custom PC board layouts. Additionally, the tool can be connected to a computer via USB, allowing easy data exchange between the asset and the PC software. SAMSUNG SP-400 II provides an intuitive interface, allowing users to easily select board types and components to be placed on each board. The model also includes a component tracing feature, which allows boards to be tested and monitored in real time, with any errors being displayed on the equipment's monitoring screen. SP-400 II is an ideal solution for the assembly and manufacture of PC boards, offering accurate alignment and placement of components, rapid soldering and a temperature-controlled atmosphere to ensure reliable results. Its components can easily be swapped out as needed, and its integrated software and USB connection offer users a comprehensive means of configuring PC layouts and easily transferring data for testing and monitoring.
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