Used SIEMENS HS50 #9133633 for sale

SIEMENS HS50
ID: 9133633
Pick and place machine, 3X8 mm Gold Feeder 3X8mm Silver Feeder.
SIEMENS HS50 is an innovative solution in the area of pc board assembly and manufacturing. It provides a range of features such as component placement, soldering, process control and monitoring, material handling, selection of components, and quality assurance. The component placement component of SIEMENS HS 50 features an accurate placement of components down to 0.1mm accuracy and minimum component height of 0.3mm. It is able to place a variety of components including non-standard parts; leaded, non-leaded, QFN and BGA packages. The component placement component is also able to be easily customised and adapted to suit specific needs. The soldering component of HS-50 offers high-speed, accurate soldering of small SMT components with a 2 watt heating element and a 20 watt selectable cooler. The soldering component is also able to be easily integrated into the placement component, and can be used with a variety of soldering pastes, fluxes and cored wires. The process control and monitoring component allows users to monitor and adjust the process parameters dynamically, ensuring consistency across all of the projects being produced. It also allows users to monitor the temperature of the solder, as well as the current and capacitance. The process control and monitoring component follows established IPC guidelines and provides detailed feedback logs. The material handling component of SIEMENS HS-50 features servo-driven joints which allow for correct and efficient loading and unloading of materials in the assembly and manufacturing process. The selection of components component enables users to choose components from pre-stored lists and is equipped with barcode and RFID technologies to simplify component selection. The quality assurance component ensures that components placed and soldered on the pc board are within the specified limits, and provides a detailed insight into the process. It constantly monitors the soldering status, component location, and solder joint quality for each component to ensure that it meets the IPC guidelines. HS50 also offers a remote diagnostic system, which allows operators to check in and monitor progress remotely. In conclusion, HS 50 is an innovative and powerful pc board assembly and manufacturing system, which provides a robust and accurate solution to a range of complex requirements. It provides a range of features such as component placement, soldering, process control and monitoring, material handling, selection of components, and quality assurance.
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