Used SIEMENS Siplace HF3 #9234038 for sale

SIEMENS Siplace HF3 is a fully automated high-speed multi-functional pick and place and soldering equipment designed to quickly and accurately assemble and manufacture Printed Circuit Boards (PCBs). The system employs a advanced vision unit and optimized feeders for even faster board assembly. The HF3 comes with a unique pick-and-place configuration that provides a wide range of pick-up heads from 1x to 24x with accuracy of +- 0.02 mm. The HF3 also features a unique 'Theta' camera machine for precise component orientation and placement. The HF3 comes with an easy to use software and operator interface and has a variety of built in features to make the manufacturing process easier and faster. These include multiple pick-and-place head modules, where components are sorted by size and shape for easy and quick placement. There is also a 'focus' feature which helps to rapidly focus on the component without having to manually adjust the vision tool. Furthermore, the HF3 includes a 'Place-On-Board' method for speeding up placement of components on the board and a 'Perfect Fit' feature for quicker and easier solder deposition. In addition, the HF3 also features a 3D topology tool that combines the power and accuracy of a 3D camera with the software's real-time inspection and traceability capabilities. The HF3 is equipped with a range of component-handling heads designed to provide maximum flexibility. A variety of ground and convection systems, including multiple hot-air, preheating, cleaning and suction heads, are also integrated. The asset also features an automated interface for quick and easy connection to external equipment and specialized production tools. SIEMENS SIPLACE HF/3 is designed for quick, easy and accurate PCB assembly and manufactured in a smaller footprint than other systems. It uses advanced technology and software to reduce processing times and cost while improving quality and consistency. The HF3 boasts a fast-cycle time of up to 8,500 components per hour with a high-precision placement accuracy of +- 0.02 mm. The model is capable of handling a huge range of components, from 0402 to lead-free BGA and CSP. This makes the HF3 the ideal platform for quick prototyping, batch production and large-scale manufacturing.