Used SIEMENS Siplace S27 #293669550 for sale

SIEMENS Siplace S27
ID: 293669550
Pick and place machines.
SIEMENS Siplace S27 is a high performance component placement and manufacturing equipment which uses a vision enabled camera to identify placement, inspect components and verify the correct operation of SMT components on a printed circuit board. This system is capable of placing components from 0201 to 100mm chip sizes at speeds exceeding 7,000 placements per hour. SIEMENS SIPLACE S 27 is equipped with an adjustable placement head, allowing for accurate and precise component placement. Its placement accuracy of ±50µm ensures that components are placed with a high degree of accuracy onto the printed circuit board. It is also equipped with an automated feeder wrench, allowing for quicker and easier replacement of component reels. Siplace S27's vision-enabled camera unit is used to identify placement and inspect components. The camera inspects each component for correct orientation, size, and placement accuracy before being placed on the printed circuit board. This ensures that all components are placed correctly and without issue. SIPLACE S 27 is equipped with a 3-kilowatt, high-frequency heating machine. This tool is used to ensure the correct placement temperature of components, resulting in improved solder joint quality and increased reliability. In addition, SIEMENS Siplace S27's intelligent cooling asset continually monitors and adjusts for component temperatures, increasing the speed and stability of the model. SIEMENS SIPLACE S 27 also features an advanced user interface. This allows for easy use and changeover of different components and adhesive materials. It also offers real-time statistics, such as current utilization levels, component counts, and other equipment data which helps operators to better measure and control their performance. Siplace S27 is designed for use in high-volume, automated component placement processes. It is an ideal system for printed circuit board assembly and manufacturing, enabling quick, accurate, and reliable placement of components onto printed circuit boards.
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