Used SIEMENS Siplace X3 #9231974 for sale

SIEMENS Siplace X3 is a high-end pc board assembly and manufacturing system for the electronic industry. It is the third generation of the Siplace series, designed to automate production and increase efficiency in the manufacturing line while allowing easy integration with current protocols. The unit features four high-speed head positions for placement of components with accuracy of 0.4 mm to 1 mm. These heads move independently, allowing for complex components such as BGA and CSPs to be placed quickly and reliably with no added cost. The feeder towers have an expanded capacity of up to 30 tapes and an improved back-to-back format allowing for higher load density. The X3 can be equipped with an intelligent spot welding station which uses wireless networking to ensure consistent and accurate welding. It also makes use of Vision55 technology which combines static and dynamic images to identify parts in a fraction of a second and optimize placement patterns. To aid production, Siplace X3 includes an intuitive graphical user interface (GUI) allowing users to easily control and monitor processes from multiple locations. The histogram function offers easy-to-read visual tracking of component hits and reject rates. For increased safety and reliability, the X3 has an upgraded fire sensor and emergency stops. In addition, the integrated defect inspector module uses advanced image processing algorithms to identify small defects such as defects in solder joints. The system also supports traceability of components with ticket printing technology. In summary, SIEMENS Siplace X3 is a powerful and reliable pc board assembly and manufacturing system designed to enhance production speed and reduce costs while giving full control and monitoring capabilities. It is ideal for electronic industries seeking to automate and streamline their production processes.