Used SIEMENS Siplace X4 #9178619 for sale

SIEMENS Siplace X4 is an advanced PC board assembly and manufacturing equipment developed for the mass production of printed circuit boards (PCBs). Siplace X4 system is an integrated unit that combines highly-accurate automated placement machines and pickup systems with a wide range of specialty modules. The machine is well-suited for the installation, transportation, and mounting of components for all types of printed circuit board (PCB) designs. The tool can handle a variety of components, including packages with multiple leads, fine-pitch components, passive components, single-row connectors, double-row connectors, and surface mount packages (SMDs). It can handle component sizes and types up to 0.06mm pitch, with speeds up to 200 components per minute (CPM). SIEMENS Siplace X4 asset features an integrated material handling model that allows the equipment to process a wide range of raw materials quickly and efficiently. This system features palletized conveyors, storage racks, bar-code labels, and material-flow optimization tools to assure material is precisely routed and tracked during the assembly process. The unit also features a comprehensive range of precision placement technologies, including laser-guided placement (LGP), light and vision placement (VLP), and full-field vision placement (FVP) systems capable of handling components up to 0.50 mm pitch. The machine is also capable of precise component picking and part identification with a high-precision laser module for reliable alignment. Siplace X4 tool also features automatic optical inspection (AOI) capabilities for a variety of user-defined circuit boards, including BGA, CSP, LGA, and others. The asset also features LCD display of the board with direct feedback for accurate part placement. Overall, SIEMENS Siplace X4 model is a comprehensive automated equipment that provides accuracy and speed for the production of a wide range of PCB designs. The system is well-suited for applications that require highly accurate and reliable part placement, including automation of complex component assemblies and high-volume, high-precision component placement.