Used SUMMIT 750 BGA #9064255 for sale

SUMMIT 750 BGA (Ball Grid Array) is a high-end PC Board Assembly and Manufacturing equipment from SUMMIT Interconnect. It is designed for high-volume production of both multi-layer and combination multi-layer assemblies. The system features a fully automated surface mount technology (SMT), dual conveyance, and integrated thermocouple temperature sensing and control for optimal SMT placement accuracy. The unit's modular design leaves space for future expansions and reconfiguration, giving engineers the needed flexibility to craft customized solutions. 750 BGA is capable of handling varieties of board sizes, from single sided to large format 24-layer boards. It comes with a flexible pick-and-place head with a vision machine that allows to accommodate a wide range of components, from 0201s to large BGAS, as well as various configurations. With its high concentration nozzle technology, SUMMIT 750 BGA achieves flawless PCB populating. The tool also includes automatic board de-panelization, lead free and tin-lead processing capabilities, combined with the ability to perform inline bed-of-nails test. 750 BGA also comes with a board desmear feature which scrubs off excess glue and flux from the PCBs. For additional cooling, the asset has an air-to-air heat exchange model. In addition, SUMMIT 750 BGA includes advanced automated tooling, programmable conveyor sections, and a central programmable logic controller (PLC) that supports almost any programmable field device network systems. Overall, 750 BGA is a powerful yet user-friendly equipment that provides automated, accurate, and efficient advanced-level assembly capabilities, along with on-the-fly program changes and data logging options. Its advanced features make it ideal for high-volume production applications.