Used VI TECHNOLOGY VI 3KP #9315555 for sale

VI TECHNOLOGY VI 3KP
ID: 9315555
Vintage: 2009
Automatic Optical Inspection (AOI) system 2009 vintage.
VI TECHNOLOGY VI 3KP is a pc board assembly and manufacturing equipment designed for high throughput production of printed circuit boards. The complete system enables efficient end-to-end production for medium- High-volume applications. The unit consists of three main components: the Load Board module, the Enclosure Station, and the Inline Printing and Placement module. The Load Board module is used to transport and position pc board assemblies onto a worktable station. The station has fully integrated sensors, armament options, mounting collars and soldering fixturing. It also has software components such as a barcode reader and a workflow scheduler. The Inline Printing and Placement module is used to print the pads directly on the board surface, and automatically place components before soldering. It is equipped with a visioning machine to ensure accurate placement of components and soldering of parts. This module has a robust and fast accurate automated pick-off tool that guarantees reproducible placement of parts. Finally, the Enclosure Station is used to assemble the pc board assemblies into the final product. It features a precise guiding asset for PC board alignment, with controlled vacuum-level capturing, and a part verification model using cross illumination, and intelligent DILER robot for the application of the enclosure. The equipment utilizes production control software to manage product scheduling, follow quality guidelines and manage throughput. It has an easy-to-use graphical user interface for data entry and data monitoring, as well as soft barcode tracking and automated process monitoring. VI 3KP system is designed to continuously improve production costs and reduce lead times. It combines the accuracy of traditional pick-and-place robot systems with the efficiency of automated assembly, testing, and end-of-line packaging systems. This makes it ideal for manufacturers of all sizes producing medium to high-volume printed circuit board assemblies.
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