Used VI TECHNOLOGY XB.Z3.350 #9249259 for sale

VI TECHNOLOGY XB.Z3.350 is a revolutionary pc board assembly and manufacturing solution. It offers unparalleled accuracy, speed, and scalability. The XB.Z3.350 equipment features an advanced vision system for image-sensing and inspection. This unit utilizes advanced algorithms and multi-camera optics to analyze images captured from each side of the Printed Circuit Board (PCB). Compared to traditional ways of forming parts, this vision machine increases accuracy by as much as 600 percent. High-resolution cameras, 140 million pixel resolution and light source integration offer users the flexibility to work with various layers and shapes. The XB.Z3.350 tool also offers state-of-the-art precision placement and pick-and-place accuracy. The asset's pick-and-place head is capable of accurately detecting and placing components with a repeatability accuracy of ±0.02 mm. This ensures that the components are placed accurately and precisely on the PCB and that there is minimal risk of error. Furthermore, the XB.Z3.350 model has a robust soldering feature. It offers a choice between three soldering modes, allowing users to select the most suitable soldering method for their specific application. The three modes are: laser soldering, hot air soldering, and press soldering. The XB.Z3.350 also features an intuitive user interface, which makes it easy to operate and use. This equipment has a color touch-screen display that provides detailed information to help users manage the parts and components on the PCB quickly and easily. The XB.Z3.350 offers users high levels of scalability and a long-term investment return. This system is capable of handling up to 350 parts per layer, and its multi-lane architecture allows for multiple boards to be processed and assembled simultaneously. The XB.Z3.350 is also capable of producing up to 12000 parts per hour, making it an ideal choice for high-volume production tasks. Overall, VI TECHNOLOGY XB.Z3.350 is an incredibly powerful and efficient pc board assembly and manufacturing unit. It offers advanced imaging and alignment systems for unsurpassed accuracy. It also provides users with state-of-the-art precision placement and pick-and-place capabilities, and robust soldering options. Finally, the machine is extremely scalable and provides a long-term return on investment.