Used YESTECH B3 #9039961 for sale
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ID: 9039961
AOI System
Green lighting
Camera: 25 micron
Pixel size: 12 micron
OS: Windows XP
Software: 2.7.7
2008 vintage.
YESTECH B3 is a state-of-the-art PC board assembly and manufacturing equipment designed to improve productivity and reduce costs. It is an all-in-one solution for placing, soldering, and testing components on to Printed Circuit Boards (PCBs). The system includes a precision placement head, high-accuracy soldering unit, 3D vision machine, and automated test capabilities. B3's placement head is capable of accuracy as low as +/- 5 microns when placing 0402 components on the board. It is also capable of handling delicate components, such as Quad Flat No-leads (QFNs) and Bi-Polar Transistors (Bipolar JFETs/BJTs), and is able to deliver a maximum placement rate of 25,000 components per hour. It comes equipped with a variety of interchangeable nozzles and feeders to accommodate a wide range of components. The high-accuracy soldering tool includes a diamond-pattern furnace and uses a patented process to ensure precise soldering results and lower costs. This improved process is highly consistent and works with any solder paste formulation, ensuring compatibility with different customer processes and space-saving designs. YESTECH B3's 3D vision asset is capable of capturing and tracking board position as well as picking up on any defect in the solder joint - making sure each component has been soldered and assembled correctly. It can also detect ghost components, mis-orientation, insufficient solder and more. Finally, the model comes with automated test capabilities for both functional and electrical testing. The test controls monitor each and every component on the board, giving users full confidence that the board is operational and safe to use. B3 is an all-in-one, versatile, cost-effective solution for PC board assembly and manufacturing. With its advanced features, it helps companies improve their productivity and save on time, money, and resources. Its precision placement head, high-accuracy soldering equipment, 3D vision system, and automated test capabilities make it the perfect fit for any PCB assembly and manufacturing project.
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