Used YJ LINK AUD-23CE-X #9394742 for sale
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YJ LINK AUD-23CE-X is a computerized board assembly and manufacturing equipment specifically designed for small- to medium-scale operations. With its modular design, it allows for flexible and rapid changes to the system as the production changes, making it the ideal choice for applications that may require rapid production changes. AUD-23CE-X unit consists of various components including a board substrate, components, stencils, and nozzles. Each component is designed to work together to handle multiple functions. The board substrate is a multi-layer board, which provides a stable base for attaching other components to the machine. The components are either soldered onto the substrate or mechanically attached with screws. The stencils are used to lay down the component patterns onto the substrate while the nozzles are used to place components into their designated locations. YJ LINK AUD-23CE-X tool also has a user-friendly interface, which simplifies the setup and operation of the asset. It includes a variety of options that provide flexibility in the design and fabrication process. For example, the user can select various types of components to be placed and the board layout can be customized with an application for custom board designs. In addition to its ease of operation, AUD-23CE-X model is highly reliable. It features an integrated testing equipment, which can quickly spot any potential errors during fabrication and even has an automated inspection system for components that already have been soldered onto the board before the board is released for assembly. Lastly, YJ LINK AUD-23CE-X unit is relatively low cost due to its modular design and its ability to utilize high-quality components. It is also highly efficient, reducing production time and increasing throughput due to the automated processes that it features. This makes it an ideal choice for companies looking for an efficient and cost-effective way of manufacturing and assembling boards quickly and accurately.
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