Used ZEVATECH / JUKI KE 700 #122709 for sale

ZEVATECH / JUKI KE 700
ID: 122709
Pick & place machine LA SENSOR lasers available 2000 vintage.
ZEVATECH / JUKI KE 700 is an automated PC Board Assembly and Manufacturing equipment that leverages leading-edge precision motion technology and state-of-the-art vision systems to deliver accurate, efficient results. Its extensive range of functions and features make it suited to high-demand applications, where speed, accuracy and quality are essential. JUKI KE 700 features an advanced vision inspection system, which provides razor-sharp images of all assembly activities. The dynamic vision unit detects and compensates for any mechanical misalignment, and monitors soldering processes with extreme accuracy. It is also capable of automatically inspecting component placement, solder joints and component integrity, making sure all assembled components meet industry standards and customer quality requirements. ZEVATECH KE 700 also features high-speed component placement with pin transfer technology. This enables component placement up to 35,000 cph (component placements/hr). To ensure accuracy, it uses advanced algorithms to identify component orientation, size and shape information, and its advanced 3D placement accuracy is ±0.02 mm. The machine also offers advanced underfill application capabilities. It utilizes multiple nozzles to accurately target the exact areas to be processed while forming the desired underfill pattern. The tool can accurately apply a variety of materials, including fluids and pastes, both before and after component placement. KE 700 also offers component handling capabilities with a choice of two different component feeders: a linear feeder and a fully geared linear feeder. It is capable of accommodating component sizes of 01005 to 110 x 100 mm and can handle up to 180 component types. Overall, ZEVATECH / JUKI KE 700 is an advanced PC Board Assembly and Manufacturing asset that combines the latest technologies to deliver efficient, accurate results. It features high-speed component placements, advanced vision inspection, and underfill application capabilities, making it ideal for high-volume applications. Its multiple component feeders and advanced placement accuracy ensure consistently accurate, efficient results.
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