Used VISCOM S3088 SPI #9282756 for sale

VISCOM S3088 SPI
Manufacturer
VISCOM
Model
S3088 SPI
ID: 9282756
Automatic Optical Inspection (AOI) system.
VISCOM S3088 SPI ( Solder Paste Inspection ) is a PC board inspection equipment designed for automated visual inspection ( AVI ) of printed circuit board ( PCB ) assembly processes. This system is used to detect small solder paste and component voids or misalignment during surface mount technology ( SMT ) assembly operations. The S3088 utilizes a large area inspection mirror capable of achieving angular and shift adjustments, making it possible to inspect large PCB boards. The adjustable area cameras make it possible to scan multiple boards at the same time with different image height and resolution settings. The unit boasts an advanced high-resolution camera to identify small discrepancies as small as 20 microns. This advanced capability, combined with advanced algorithms and the latest software, allows the machine to quickly and accurately detect defects such as poor solder paste registration, foreign material, component misalignment, incorrect reflow temperature, and solder bridge formation. The S3088 also provides an intuitive, user-friendly Windows-based interface for users to program and quickly configure various inspection settings. The Windows graphical user interface (GUI) allows for quick setup and configuration tasks. This tool also features a powerful image processor and advanced vision control software, allowing for features such as 3D component-evaluation, defect-recognition, and data recording. Inspection data is stored in the S3088 database and can be easily retrieved, analyzed, and reported. The S3088 is fully compatible with IPC standards and provides several report templates for users to quickly generate comprehensive inspection data. The powerful software packages include built-in analytics to allow for tracking of defects, changes in process parameters, and trends over time. S3088 SPI is an advanced PC board inspection asset, designed to detect fine solder paste or component voids, misalignment, incorrect reflow temperature, and bridge formation in surface mount technology (SMT) assembly processes. The model utilizes an adjustable large area inspection mirror, a high-resolution camera, and advanced algorithms to quickly and accurately detect tiny defects. The equipment is fully compatible with IPC standards and the Windows graphical user interface (GUI) makes it easy for users to configure and analyze inspection data.
There are no reviews yet