Used HUGHES HTT 550 #32670 for sale

Manufacturer
HUGHES
Model
HTT 550
ID: 32670
Solder reflow system.
HUGHES HTT 550 is a thermoplastic bonder specifically designed to bond thermoplastics in industrial processing. It has a variety of features and benefits that make it one of the most efficient and reliable bonders on the market. HTT 550 uses infrared heating technology to quickly and accurately bond various thermoplastics and their associated materials. The heating element consists of multiple emitters which heat and cool the thermoplastics at an adjustable speed, ensuring a consistent bond. The infrared heating also provides a no-contact solution to ensure the thermoplastic is evenly and quickly heated for efficient bonding. The infrared heating element also prevents damage to the material due to too much heat or friction from mechanical contact. HUGHES HTT 550 has four main operational modes; fast, strong, basic, and advanced. These modes offer a unique set of advantages when bonding thermoplastic parts and components. The fast mode provides faster temperature ramp-up and cool down times, allowing for a decrease in production times. However, fast mode may not produce the strongest bond, which is why the strong mode is optimal for permanently bonding parts and products. The basic and advanced modes provide the user with the highest level of control for the most complex applications. Both of these modes allow for a wide range of settings, including the type of thermoplastic being bonded, the amount of pressure and heat generated, and the temperature of the end-application. This level of control is necessary for completing all operations involving thermoplastics. HTT 550 provides a safe and economical way to bond thermoplastics and their components. The operator does not need to be physically present for the heating process and the infrared heating element ensures that thermoplastics are not damaged due to too much heat or friction. Additionally, the wide range of operational modes allows the user to find the best settings for each application while quickly completing the bonding process.
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