Used PVA 350 #9198731 for sale

PVA 350 is an etching and ashing equipment designed for high throughput processing. It is used in the semiconductor industry to remove organic materials and contaminant films from wafers in the process of manufacturing these devices. 350 system uses an Inductively Coupled Plasma (ICP) to generate atomic particles that interact with and remove material from the surface of the wafer being processed. This ICP technology is one of the most precise and accurate etching/ashing processes available, providing a high degree of accuracy, repeatability and uniformity. PVA 350 unit also comes equipped with a number of features that make it particularly user friendly. These features include automatic pathing, a digital OCR for accurate wafer recognition, precise power control of the ICP machine, a sophisticated vacuum control tool, and a reliable and robust control asset. 350 can etch material from the surface of a wafer down to a depth of several Angstroms, making it an ideal tool for wafer fabrication. It is also capable of generating high-resolution images, making it an excellent choice for metrology and inspection purposes. The model can accommodate both 8-inch and 12-inch wafers, and it can be integrated with a variety of existing systems. It also offers chamber cleaning and remote diagnostics, making it easy to maintain and operate. Overall, PVA 350 is a reliable and versatile etching and ashing equipment. Its ICP technology ensures accurate and repeatable results, while the user-friendly features make it very easy to use. For any semiconductor fabrication application, 350 is an excellent choice.