Used ACCRETECH / TSK MHF 300L #9145225 for sale

ACCRETECH / TSK MHF 300L is a fully automated prober for the rapid inspection of wafer and die surfaces. This prober is designed to provide high aggregate throughput of up to 300 wafers/hour with rapid equipment setup and excellent particle and dust control. In addition to being designed with light weight and low inertia manipulators, TSK MHF300L also comes with a dynamic wafer handling equipment and programmable robot controllers that ensure greatly increased test accuracy and productivity. It is equipped with TSK automated wafer and film inspection systems, which possess the ability to detect various kinds of defects including die cracks that are not visible to the naked eye. Relative positioning between the prober and an analyser can be adjusted without affecting the overall system stability. This makes it easier to reduce the gap between test results and analysis of physical defects on the wafer or die. The prober allows for a wide variety of probe head configurations and provides a programmable control platform for precision probing. The unit also boasts a fully programmable 6-axis wafer stage with an advanced wafer handling machine that provides rapid and repeatable results. This tool allows for quick and reliable automated wafer alignment and motion. ACCRETECH MHF 300 L also comes with multiple types of wafer chucks, including a pressurized chucks asset which provides an enhanced parallelism between the wafer surface and the probe head. It also includes contact and non-contact measurement capabilities, variable probe force settings for accurate probing and a variety of test capabilities. For precise wafer surface measurement, ACCRETECH / TSK MHF 300 L includes a high resolution CCD camera model. This allows for precise die-to-die measurement with repeatable accuracy. The prober is also capable of scanning the wafer for particles and dust before and after the scan. ACCRETECH MHF300L is a highly reliable, versatile prober that provides significant cost savings in the form of increased productivity in testing and measuring the properties of wafers and dies. It is suitable for use in both production and development environments, and in applications such as semiconductor test and wafer manufacturing.