Used ACCRETECH / TSK Surfcom #9206329 for sale

ACCRETECH / TSK Surfcom is a sophisticated prober designed to provide a cost-effective and reliable solution for measuring and analyzing the surface characteristics of semiconductor components. The unit is designed for end-of-line testing and wafer-level probing and has built-in features including a vacuum chuck, air jets, optical sensors, and a multi-axis motion controller, which make it ideal for a wide variety of wafer probing applications. It can measure a variety of features including topography, surface finish, and electrical properties. TSK Surfcom has a compact design that takes up minimal workspace and is easy to integrate into existing test systems. It uses a multi-axis motion controller to provide fast and accurate movement and positioning of the probe head over the sample. The unit also features easy calibration for measuring tip height with a resolution of 0.001 mm. It also includes a piezo-controlled chuck that maintains a consistent gap between the probe and the sample. An air platter system helps to prevent sample warping and reduce the risk of damage to fragile materials such as photomasks. ACCRETECH Surfcom also includes a range of optical sensors with resolutions of up to 0.5 µm. These sensors measure surface features such as flatness, unevenness, and scratch depth as well as die-to-die parallelism and corner radius. It also features an automated programmable scanning system that can be used to quickly map surface features such as deviations and topography. The unit is also able to measure electrical properties, including surface potentials and resistance. It includes a set of probes that are connected to an external power supply and are able to measure the voltage or resistance between points on the sample. This can be used to detect tiny defects and perform electrical characterization of the sample. Overall, Surfcom is an innovative and reliable prober that can provide accurate measurements for semiconductor devices. It offers a cost-effective and highly flexible solution for end-of-line testing and wafer probe applications. With its array of features, it is ideal for use in a wide range of semiconductor R&D, prototyping, mass production, and engineering applications.