Used ACCRETECH / TSK UF 190A #293830480 for sale

ACCRETECH / TSK UF 190A is a fully-automated, high-precision probe station designed for high-screening and fault analysis. The system uses a precision air bearing design to move and rotate the wafer on its axis for high accuracy, speed, and repeatability. Its thermally and vibrationally controlled environment allows for quick thermal testing and fault diagnosis of devices. TSK UF 190A is constructed using an aluminum alloy frame, which is temperature-stabilized by an integrated chiller unit. This ensures that the stationary stage position remains consistent during testing operations. The wafer stage is made of a hollowed out carbon fiber cylinder, which is capable of supporting up to a 300 mm wafer and spinning at up to 6000 RPM. ACCRETECH UF 190 A probe station is capable of probing wafers with a variety of different probes, including air and micro probers, RF probes, fibered probes, and more. Probing operations are performed with a 4-axis dual-level XYZ positioner, providing high-precision movement and alignment. The system is equipped with an integrated optical microscope, allowing for quick visual inspection of sample area and access to detailed images. UF 190 A has a wide range of built-in software tools, making it easy to monitor, capture and analyze data. Custom measurement settings, wafer maps, and a graphic user interface are all included to streamline test procedures. With its industry-leading multi-probe capabilities, TSK UF 190 A is able to quickly and accurately detect defects, accurately monitor device performance, and collect data in order to improve wafer yield and reliability. UF 190A is an ideal tool for manufacturers of semiconductor, MEMS, and optoelectronic devices. It can be used for both quality control and research and development operations. With extremely high levels of accuracy, repeatability, and speed, ACCRETECH / TSK UF 190 A can help to improve the quality of your products.