Used ACCRETECH / TSK UF 190B #293827348 for sale

ACCRETECH / TSK UF 190B is a prober designed for on-site, on-wafer electrical probing of devices in the 200 mm wafer size range. It is a flexible, high-performance, on-site prober that can meet the needs of a wide range of technical users. It combines a state of the art robotic wafer gripping system, a virtual-stylus probe, and advanced calibration feature to provide high accuracy and reliable results. TSK UF190B prober has a powerful robotic wafer gripping system that can handle wafers up to 200 mm in diameter and up to 12 mm thick. The prober is equipped with a virtual-stylus probe, which is a non-contact / alignment sensing probe. This virtual-stylus probe is designed to provide simultaneous x,y,z coordination, ensuring precise contact or alignment with the sample surface. This probe can be configured in two-, three- or four-axis configurations to meet the probing requirements of various production and research applications. The advanced calibration feature of the prober allows the user to determine the repeatability of the wafer movement by comparing samples taken at different locations on the wafer. This provides for increased accuracy and repeatability during the probing process. In addition, this prober also features the unique LMCOM automatic global alignment correction. This correction provides for a more precise alignment between the samples and the probe, eliminating the need for manual correction. The automation feature of the prober allows for unattended operation, making it possible for the user to focus on other tasks while the prober is running. The prober is also equipped with an intuitive user interface which makes it easy to program and trace probing paths. ACCRETECH UF 190 B has an advanced data acquisition system with an integrated Ethernet connection. This allows for rapid transmission of test results from the prober to a local or remote computer. ACCRETECH / TSK UF 190 B is an ideal instrument for production and research applications. Its high accuracy, reliable performance, and advanced automation features make it suitable for a wide range of applications. From device characterization, yield improvement, and process control, TSK UF 190 B is an ideal choice for on-site, on-wafer probing of complex device structures.