Used ACCRETECH / TSK UF 200 #293600299 for sale

ACCRETECH / TSK UF 200 is a prober designed for wafer probing, electrical measurement, and packaging test applications. It uses a highly accurate, single-point clamping, probing vertical head with a measuring range of ±2 μm, a high-precision automatic alignment function and a one-phase/two-phase switching head. The vertical head utilizes a highly accurate single-point clamping mechanism to reliably secure and position the wafer during the probing process. The X, Y and Z stages can move independently of each other and are electronically synchronized for a precise, consistent position and alignment of the wafer to the test probes. The Head can easily be exchanged between one-phase and two-phase operation. The single-point clamp is firmly stable even during long probing cycles, providing a uniform probe contact force and high resolution measurements. The highly accurate and reliable automatic alignment function of TSK UF 200 allows for precise and detailed adjustments based upon user-defined parameters. This function is capable of aligning multiple measurement points on each sample and quickly and accurately coordinates the location of the probe tip to the wafer calibration mark. This ensures a high accuracy and repeatability rate. The prober is also capable of measuring wafers with standard wells and grooves, making it suitable for various wafer probing tasks. ACCRETECH UF200 also offers a high degree of automation and repeatability, having a maximum positioning speed of 0.30 mm/s and a measuring accuracy of less than 0.01 mm per step. This provides an extremely reliable And fast probe process for testing and measuring with a minimum setup time. It features a wide range of accessories that can be used to customize the probe cycle for specific applications, such as wafer flatness measurement, die pad testing, and solderability testing. In summary UF200 is a prober designed for wafer probing, electrical measurement and packaging test applications. It offers a highly accurate single-point clamping, probing vertical head with a measuring range of ±2 μm and an automatic alignment function, as well as a maximum positioning speed of 0.30 mm/s and a measuring accuracy of less than 0.01 mm per step. It is equipped with multiple accessories to facilitate different wafer probing tasks and provide efficient, fast and reliable processes.