Used ACCRETECH / TSK UF 200 #293615296 for sale

ACCRETECH / TSK UF 200 is a prober designed for integrated circuit wafer surface measuring, wafer backside recessing and etching, etc. It features high accuracy, flexibility, and excellent reliability. TSK UF 200 is a very precise scanning and probing equipment, providing precise measurements, validation, characterization, and defect isolation. ACCRETECH UF200 incorporates advanced CCD cameras that are designed for high speed multi-dimensional scanning of wafer surface and backside. This ensures precise three-dimensional (3D) information of the wafer and its characteristics. Additionally, advanced laser alignment systems facilitate precise alignment of the prober to each individual die. This, in turn, allows for more precise and repetitive measurements. The system utilizes a variety of techniques and technologies to accurately measure, analyze and image the wafer surface and its characteristics. These techniques include optical scatterometry, optical profiling, and spectral scatterometric imaging. Optical scatterometry is based on the use of light to measure any changes in the wafer surface. UF200 utilizes this technique to obtain detailed information regarding the wafer surface profile including height, step size, and width. ACCRETECH UF 200 also offers advanced wafer backside recessing and etching capabilities. Backside recessing is used to remove back full of excess layers in order to improve electrical performance. UF 200 utilizes a recessing scanner with highly specialized techniques and real-time analysis capabilities to precisely etch the desired amount of material. The unit also includes a dry etch machine that is used to etch and pattern the wafer backside. Furthermore, TSK UF200 includes a set of specialized metrology tools that are used to precisely analyze the wafer surface. These tools include a nano-indenter, a micro-indenter, and a surface roughness analyzer. The nano-indenter is used for quantitative measurement and analysis of mechanical properties such as modulus, hardness, and yield stress. The micro-indenter is used for calculating surface-scale features, such as shape and dimensions. Finally, the surface roughness analyzer provides detailed information about the surface morphology by measuring effects like grain size and surface roughness. All in all, ACCRETECH / TSK UF200 is a highly precise prober designed for wafer surface measuring, wafer backside recessing, and etching. The tool is equipped with advanced CCD cameras, laser aligners, metrology tools and specialized techniques that provide precise 3D measurements, etching, and analysis of the wafer surface and its characteristics.