Used ACCRETECH / TSK UF 200 #293615526 for sale

ACCRETECH / TSK UF 200 is a next-generation prober, designed for precise contact probing on a wide range of semiconductor wafers. It features unique capabilities such as precise wafer alignment and active die site calibration, as well as automated vibration control wafer probing technologies. TSK UF 200 is designed for process development to production applications, providing a precise combination of repeatability and accuracy in a cost-effective package. The probers feature a range of precision motion control systems, including bi-axial planar motion, four-index wafer holder, and die-by-die per wafer in-plane rotational motion for precise alignment of the wafer and specimens. Along with its high precision motion control systems, ACCRETECH UF200 prober also provides active die site calibration algorithms that optimise die placement accuracy, ensuring the highest possible repeatability when probing. In addition to these advanced alignment capabilities, UF200 prober also features a variety of vibration control technologies that reduce the dynamic influences on the structure of the system. This includes an active closed-loop vibration damping system, which allows dynamic adjustments to reduce vibration propagation. This ensures that the probe pins make contact with the die sites, regardless of wafer thickness or material type. In order to ensure a level of quality and reliability, UF 200 prober also comes with an advanced automation module, featuring an intuitive graphical user interface which simplifies prober setup and maintenance. This allows for the quick and simple control of automated measurement, prober control, and data management systems. For wafer manufacturing and testing applications, TSK UF200 prober also provides a range of high performance measurement instruments such as LVTs (Low Voltage Tester) that enable accurate tribological and contact measurements in order to improve process flow. These instruments are capable of measuring things such as airflow, die-probe capacitance, die-contact resistance, contact adhesion, and wafer temperature. In conclusion, ACCRETECH / TSK UF200 prober is an advanced tool for precision wafer contact probing, designed for both process development and production applications. With its advanced motion control systems, active site calibration, automated vibration control, and powerful automation module, ACCRETECH UF 200 delivers both repeatability and accuracy in a cost-effective package.