Used ACCRETECH / TSK UF 200 #293615536 for sale

ACCRETECH / TSK UF 200 (also referred to as the "Universal Frame") is a prober designed for end-user production testing and development of semiconductor and chip packages. It allows for direct electrical contact to the die within the package, allowing for the measurement of electrical characteristics of the device. TSK UF 200 prober has a wide range of features, from a heated environment for consistent temperature measurements to the ability to test high-frequency devices. It is designed for easy setup, with a user-friendly, PC-based software interface. The prober has an x/y/z stage that can move packages up to 200mm in x-y range and up to 100mm in z-range. This enables accurate probing of a large number of devices in a small area, efficiently and accurately. ACCRETECH UF200 has an extremely low vibration and high stability, allowing for precise measurements to be taken. The X/Y/Z stages are fully adjustable, with manual micrometer screws, allowing the technician to fine-tune the position of the prober so that it is exactly where it needs to be. The prober also has a built-in vision equipment, which can be used to focus the camera on the exact area of the die that needs to be tested. TSK UF200 is extremely precise, with placement accuracy as low as 0.5 microns. This enables a more reliable analysis of device performance. UF200 also has an integrated vacuum system, allowing for extremely accurate placement of the package on the prober tips. This ensures that the package will remain in place during testing, which is very important for accurate measurements. ACCRETECH / TSK UF200 is designed with an operator-friendly touch screen panel, allowing the operator to easily navigate through the settings and parameters. It also has an integrated material handling unit, so technicians can quickly load and unload packages without having to worry about handling the delicate parts. ACCRETECH UF 200 is a powerful prober, with precise measurement capabilities and user-friendly features. Its large x/y/z range, accurate placement machine, and integrated material handling tool make it a powerful tool for testing and development of semiconductor and chip packages.