Used ACCRETECH / TSK UF 200 #9195673 for sale

ACCRETECH / TSK UF 200 is an advanced prober, designed for semiconductor and MEMS testing. It is a full-fledged wafer prober that can be used to perform testing of wafers at the wafer level. The equipment is ideal for die and wafer-level yield improvement and production testing. The system consists of several parts. The core of the unit is the prober itself. This includes a high-resolution vision machine and a 200kHz scanning stage. The vision tool is used to ensure the wafer under test is correctly aligned, and can provide an exact measure of the size of each die, as well as its orientation. The scanning stage is used to position the probes over the sample so they can contact each die and perform the required measurements. The asset is capable of waveform capture and waveform capture dampening, making it suitable for analog and mixed-signal testing. TSK UF 200 also includes a servo-controlled sample holder as well as a 200mm wafer chucking model. This allows samples to be accurately and reliably loaded and unloaded for testing. The servo-controlled sample holder enables precise positioning of the wafer during testing and offers the ability to test up to four wafers simultaneously. The prober also features a high-speed scanning capability, enabling it to examine a single die or multiple dies on the same wafer quickly and efficiently. In addition to its prober, ACCRETECH UF200 also includes an AutoArc arm, which is a robotic arm that is used to perform contactless measurements. The AutoArc arm uses pyrometric alignment to accurately position probes without contact with the active areas of the dies. This eliminates the potential for die contamination and damage. The arm can also be used to maneuver metal lids and seal rings to gain access to the interior of the dies. Finally, TSK UF200 includes a control console, which allows users to control and monitor the equipment. The console has an intuitive, user-friendly interface and provides status information, logging capabilities, and data acquisition. Through the control console, users can configure the system for automatic operation, as well as for manual adjustments. This customization enables users to tailor the unit to specific testing requirements. In conclusion, UF 200 is a powerful prober solution for both semiconductor and MEMS testing. It features a high-resolution vision machine, a servo-controlled sample holder and a 200mm wafer chucking tool, an AutoArc arm for contactless measurements, and an easy-to-use control console. The asset is designed for wafer-level yield improvement and production testing, and it is capable of waveform capture, waveform capture dampening, and pyrometric alignment, making it suitable for a wide range of testing applications.