Used ACCRETECH / TSK UF 200 #9249952 for sale
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ACCRETECH / TSK UF 200 is a high-precision prober used for probing electrical and mechanical device characteristics. This device measures electrical and mechanical device characteristics using a probe tip-based approach. The prober contains a precision-drive module that controls the low-mode differential motions of a probe tip over a device surface or within a device cavity to perform electrical probing and backside physical characterizations. This prober can be used for various types of device analysis and provides an in-situ analysis capability for difficult-to-access electrical device nodes. This prober can employ various multi-dielectric measuring modes to accurately capture information about device structures with feature sizes ranging from sub-micron to millimeter-scale. TSK UF 200 features a very low-noise environment and a low-mass, short-lever probe arm that ensures stability during device probing. The probe arm holds a gold-plated, non-magnetic cantilever tip that offers a high degree of resolution and accuracy during electrical probing. ACCRETECH UF200 can operate a range of ladder probing, scrub, and electrical testing processes. The ladder probing process involves a scanning and oscillation technique, which is used to map electrical paths of specified interconnects on the device. The scrub process is used to analyze the weak connections between thin wafers by scrubbing the contact sites with a microscope connected probe, allowing for failure analysis of large devices. The prober also supports electrical testing process, which involves applying different levels of electrical signals before and after pinpointing interconnections for accurate measurement of electrical characteristics. Additionally, ACCRETECH UF 200 is integrated with a range of productivity tools, including in-situ probe penetration depth monitoring for critical electrical probing, ultra-high-resolution imaging for nanometer-scale feature identification and characterization, and intelligent autofocus for multi-dielectric and contact-resistive measurements. The prober is programmable and compatible with Windows-based and Linux-based operating systems. Its support for a range of probing technologies can accommodate applications like CMOS image and circuit element fab probing and wafer level testing of DRAM and SRAM components. All these features make TSK UF200 a reliable and powerful prober for deeply probing electrical and mechanical device characteristics.
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