Used ACCRETECH / TSK UF 200 #9255177 for sale

Manufacturer
ACCRETECH / TSK
Model
UF 200
ID: 9255177
Vintage: 1997
Prober Docking type: Hinge 1997 vintage.
ACCRETECH / TSK UF 200 is a type of prober used in semiconductor manufacturing and testing. It is an advanced, ultra-precise and high-resolution prober system designed to provide an optimal solution for challenging testing requirements. It offers flexible and versatile options for a variety of applications, from wafer qualification to device or test chip probing. TSK UF 200 has a high-resolution optical microscope, miniature objectives, and an advanced electronic control system to ensure precise and accurate probe placement. It offers two different placements: vertical and horizontal. The vertical placement offers superior stability, eliminating vibration and providing fast and accurate test results. The horizontal placement makes it possible to position the prober at the optimum positioning angle to control and increase yield. The prober also features an advanced vision system with a high-resolution image sensor to ensure accurate and repeatable results. ACCRETECH UF200 is equipped with proprietary non-contact operating systems that reduce the wear on traditional contact probers. This allows for a longer lifespan, higher throughput, and reliability. Additionally, the prober has robust vibration-stopping capabilities that minimize the effects of both static and dynamic vibration. This allows for the reliable reproduction of complex test patterns and supports the testing of a variety of devices. TSK UF200 can support high-end applications, such as defect inspection, process control, failure analysis, defect diagnosis and yield prediction. It can also provide detailed 3D analysis of sensing circuitry, analyzing structures down to the submicron level. The prober offers improved probing accuracy and repeatability, because of its advanced scan rotary compensation technology. This allows for tighter tolerance and better probe alignments, ensuring consistent testing results. Lastly, the prober is designed to meet high-speed, high-resolution and perfect overlay requirements such as metal layer alignment, surface swelling and crystal ageing. Its smaller size and easier operation makes it suitable for a wide range of R&D and large-scale production. It is available in different configurations, depending on the test objectives, wafer sizes and site requirements. This advanced prober provides reliable, repeatable and accurate results, making it an ideal tool for advanced semiconductor test and research.
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