Used ACCRETECH / TSK UF 200 #9255183 for sale

ACCRETECH / TSK UF 200 prober is a complete high-performance prober specifically designed to provide the highest throughput and accuracy in automated probing solutions. TSK UF 200 increases throughput and test yield while reducing prober maintenance time by offering reliable and precise contact force measurement. The probe head provides improved focusing and alignment, resulting in improved test accuracy and repeatability. ACCRETECH UF200 prober is powered by a high-precision multi-axis controller which enables precise alignment and positioning of test probes in both the X, Y and rotational axes. The prober is able to handle a wide range of test probes, ranging from 6 to 50 millimeters in size with a maximum force measuring from 10 to 1500 grams in five ranges. A unique feature is its simple calibration mode which makes it easy to set the location of the edge of the probe tip for precise test placement. It is also capable of maintaining precise contact forces for a wide range of contact probes. UF200 is equipped with an optimized wafer alignment algorithm, which ensures a precise alignment to the wafer's surface, resulting in improved test yield and further reducing critical test step time. The high acceleration and velocity provided by the multi-axis non-orthogonal motion control enables UF 200 to reach test locations quickly, minimizing test times and reducing test cycle time. ACCRETECH / TSK UF200 prober also offers stability and accuracy due to its durable, robust construction. The prober is designed to maintain the required alignment, size and stability of contact components in a stable fashion even in high contact force applications, while guaranteeing the precision of contact force measurement. In addition, ACCRETECH UF 200 also features an anti-vibration system and a continuous monitoring of the live contact force which ensures accurate, consistent and repeatable contact force testing. TSK UF200 is an ideal candidate for automated wafer probing, providing high throughput and accuracy for a variety of applications. With its high-precision multi-axis controller and optimized wafer alignment algorithm, ACCRETECH / TSK UF 200 ensures a precise test probe contact that can accurately measure all forces with minimal impact on test cycle time, resulting in improved test yield with more reliable and repeatable measurements.