Used ACCRETECH / TSK UF 200 #9260079 for sale

Manufacturer
ACCRETECH / TSK
Model
UF 200
ID: 9260079
Prober Temperature: Hot / Ambient.
ACCRETECH / TSK UF 200 prober is a 3D semiconductor probe station designed for wafer probing needs. It is the perfect choice for applications that require the highest precision measurements and cleanliness. TSK UF 200 features an automated textured chuck, which enables more precise alignments to smaller components and allows a fast, repeatable wafer movement. The equipment also has an optical microscope that provides high resolution at low magnifications and a high force stage drive that ensures stable and repeatable measurements of voltage, current, and capacitance. For maximum accuracy, ACCRETECH UF200 is designed with a torsion balance assembly that has an active vibration damping system. The same assembly is used for fine alignment and for force measurement. It has an isolated grounding plate that ensures high quality, repeatable measurements as well as having a reduction of potential ground noise induced by vibrations. TSK UF200 also has an automated tweezers head alignment unit, which reduces manual alignment steps and helps speed up wafer loading. The automated tweezers head alignment machine also compensates for variations due to aging and environmental conditions, allowing repeatable measurements even in demanding applications. This prober also has a high vacuum chuck that supports high temperature operations (up to 400°C) and gives accurate and repeatable measurements while eliminating the oxidation risk associated with air-based measurements. Another feature offered by UF200 is its automated tuning tool. This asset includes a wafer scanner that allows precision measurements on high aspect ratio sites and through-hole geometries. Finally, ACCRETECH / TSK UF200 prober provides stability and repeatability in a wide range of measurements including resistance, capacitance, and charge leakage values. This prober is perfect for any application needing high levels of accuracy and repeatability.
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