Used ACCRETECH / TSK UF 2000 #293703347 for sale

Probers, 6" GaN, 4" TAIKO, 8" Dual temperature Probing direction: X-Axis / Y-Axis direction Automatic needle height alignment Automatic probe to pad alignment COGNEX 8500 Series Ethernet Needle cleaning brush Needle polish stage type Probe mark inspection Wafer ID reader GPIB RS232 USB Port Cleaning height detection sensor Multi-hole air cool chuck, 8" Wafer mapping Temperature: ±3°C Humidity: 35%-65% Thickness variation: ±30 µm Die size: Minimum: 750 mm x 1000 mm Maximum: 4750 mm x 1000 mm Bond pad size: Minimum: 90 mm x 132 mm Maximum: 397 mm x 144.5 mm Compressed air supply: 0.45 - 0.7 MPa Vacuum supply: >30 L per minute Power supply: 220 VAC, 50/60 Hz 2019 vintage.