Used ACCRETECH / TSK UF 200A #9206977 for sale

ACCRETECH / TSK UF 200A is a prober that is specifically designed for medium to large die probing applications. It is a fully automated, high-precision machine that is capable of working with a wide variety of materials and packages. TSK UF200A offers a very wide X-Y range, which makes it suitable for probing even the smallest die structures. ACCRETECH UF 200 A utilizes a high-precision six-axis articulating arm, with a resolution of 10 microns in all directions, allowing for very precise and repeatable results. Its modular design ensures a highly efficient and reliable operation with minimal maintenance. The Dual Probe Load Station (DPLS) accommodates two types of miniature internal probes that can handle up to 8.5 kV contact resistance. The Multi-Probe Control (MPC) system allows for a variety of probing modes, including contact, non-contact, current, and junction scan. In addition to its versatile probing capabilities, TSK UF 200 A also offers a range of speed and precision enhancements that ensure very high throughput rates. An automated die sorting system automatically removes misaligned die from the probing area, improving the efficiency and accuracy of the probing process. It also includes an optical light source for recognizing the packages on the wafer and triggering the probing sequence. Additionally, TSK UF 200A offers a range of software options to facilitate the programming and control of the prober. With the integrated software, users can define and edit simple patterns of probes, measure voltage, and debug and repair faulty probes. The integrated material handling system allows the user to move and position wafer stackers, while a probe guard is included to prevent the probes from connecting with other objects when not in use. All in all, ACCRETECH UF200A is a state-of-the-art prober that is ideal for medium to large die probing applications. Its wide X-Y range, high-precision six-axis articulating arm, and many other features make it an ideal choice for die probing in the electronics industry.