Used ACCRETECH / TSK UF 200A #9243576 for sale

Manufacturer
ACCRETECH / TSK
Model
UF 200A
ID: 9243576
Vintage: 2004
Prober Chuck type: Nickel / Hot (30°C ~ 150°C) Docking type: T6371 COGNEX 4300 Loader type: Right Floppy Disk Drive (FDD) MO Hard Disk Drive (HDD) Probe card change type: MPC Hinge: MHF300S Manipulator Temperature controller 2004 vintage.
ACCRETECH / TSK UF 200A is a high-precision prober with a long track record of reliable performance in the semiconductor industry. It is a modularly-configured prober, with a wide range of optional components for completely customizing the equipment for specific applications. The base unit includes the tabletop base, probing heads, wafer handling system, prober enclosure, environmental control, and a selection of wafer handling tools. The prober is designed to accommodate a wide range of wafer and package sizes, thicknesses, and materials. The probing heads are capable of ± 25μm accuracy in the x/y plane, and ± 15μm in the z-axis, yielding high-resolution and reproducible results. The fully-automated probe head changer simplifies swapping out various probe types, while the prober's pro-active dynamic tuning feature provides the maximum stability when moving the prober between different wafer types and lots. The wafer loading and unloading systems ensure a consistent and reliable transport of wafers. The advanced wafer handling unit properly handles wafers up to 7 inches in size, and cuts cycle time by reducing the need for manual intervention. The prober's unique clamping machine helps ensure consistent, accurate contact between the probes and the chip surface, improving yields. The prober enclosure provides a contained, temperature-controlled testing environment, performing thermal conditioning and protection against ESD and contaminants. Robust safety features ensure safe operation and reliable results. TSK UF200A prober provides reliable, automated wafer probing with exceptional accuracy and repeatability. Its modular design, expandability, and advanced safety features make it an ideal choice for a wide variety of applications, from semiconductor and automotive testing to device packaging and semiconductor characterization.
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