Used ACCRETECH / TSK UF 200A #9276386 for sale

ACCRETECH / TSK UF 200A Prober is a standalone, fully-automated, high-precision, edge-contact prober designed for accurately probing flip chip and solder bump device materials on wafers. Its features make it especially suitable for advanced device testing applications. The main features of TSK UF200A Prober include high-precision approach and retreat motions of the probe arm, both of which are driven by piezoelectric positioners. These movements are monitored and controlled by the advanced motion control system, ensuring absolutely repeatable probes even between differently sized contact tips. The distance between probe and wafer is optimized before each test process to guarantee optimal contact quality. The prober is highly configurable in terms of probe force, contacting speed, scanning speed and alignment accuracy, making it suitable for use in a wide range of testing applications. ACCRETECH UF 200 A Prober also comes with a variety of accessories for different application requirements. These include a force sensing unit for controlling the nudging force of the probes, a temperature control unit for measuring the wafer temperature, a base heater for controlling the ambient temperature, a wafer-aligner for ensuring the wafer is properly aligned before and during test process, and a vacuum clamping unit for tightly fixing wafer to platforms. In addition to these features, ACCRETECH / TSK UF200A Prober also offers HMI and Windows-based software for programming and controlling the prober. This software makes it easy to develop and upload custom scripts to probe and test complex device structures or structures with multiple contact points on the same chip. Overall, TSK UF 200A Prober is an excellent choice for high-precision and accurate probing and testing of flip chip and soldering bump devices. Its advantages in terms of accuracy, repeatability and configurability make it suitable for a variety of applications in the semiconductor industry.