Used ACCRETECH / TSK UF 200S #9365978 for sale

ACCRETECH / TSK UF 200S
Manufacturer
ACCRETECH / TSK
Model
UF 200S
ID: 9365978
Vintage: 1995
Prober Master CPU (Encoder mode) non-functional 1995 vintage.
ACCRETECH / TSK UF 200S is a semi-automatic, general-purpose prober designed for probing and characterization of wafers and other semiconductor devices. It is a point-and-shoot equipment, capable of measuring contact resistivity, device admittance, and flip-chip scale capacitance. The prober also provides the ability to set up customized electrical tests with a variety of test diamonds, allowing for optimal probing of a range of device geometries. The prober is constructed with a stainless steel general frame that supports four sets of load and probe stages for easy access to all of the components. An optional jig table can be added for multiple device probing. It also has an optional stage adapter to accommodate 3, 4, 5, 6, 7 and 8" wafers. TSK UF200S uses a precise point and shoot probe head for accurate probe placement in small IC packages. The probe head is also interchangeable to accommodate a wide range of probes. The prober has an integrated laser positioning system, which accurately places probes on small pads and deep vias of flip chip devices. The unit works with both manual and automated operation, allowing for either precise manual verification or repeatable probes alignment with automated cycles. It also has an optical focusing machine to ensure precise focus alignment. ACCRETECH UF 200 S has an intuitive touch-screen interface with integrated software, simplifying prober operation and data analysis. It allows users to modify the parameters according to specific test requirements and save regularly used settings as pre-set programs. The prober also includes a wide range of user-defined and set-up tools, including a library of various probes. TSK UF 200S is CE certified and UL/CSA listed, ensuring safe and reliable operation. It is suited for electronic and semiconductor laboratories, and production departments performing high reliability testing such as wafer-level packaging and die-level characterizations.
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