Used ACCRETECH / TSK UF 200SA #9235934 for sale

ACCRETECH / TSK UF 200SA
Manufacturer
ACCRETECH / TSK
Model
UF 200SA
ID: 9235934
Vintage: 2004
Prober Manipulator: MHF300L2 Stage chuck: Gold chuck Temperature control: Hot chuck Frequency band chuck temperature: 30°C-150°C Cleaning unit type: Ceramics pad CPU Board version: 7507A Ethernet Motor type: APC Probe card holder TFT LCD Color display, 10.4" No OCR Slot number / Boards Slot 1 / CPU Slot 4 / VGAC Slot 6 / COGNEX Slot 8 / PIO Slot 10 / TTL/GP-IB Slot 11 / 5CH PGEN Slot 14 / CAP Sensor Slot 16 / AVME Slot 17 / LD. IO Slot 18 / LD. PGEN VME Rack / Board name / Description 1 / Master CPU / ADVME 7507 4 / VGAC2 / - 6 / ITV / COGNEX 8200 8 / PIO / - 10 / GPIB / - 11 / (5) PGEN / - 13 / Slave CPU / AVME-344A 14 / Capacitive sensor / - 16 / LD I/O-1 / AVME-115B 17 / LD PGEN-1 / - 18 / PI IO / - ETC: COGNEX Board version: 8200 External media: FDD, MOD 2004 vintage.
ACCRETECH / TSK UF 200SA is a full-featured prober designed to offer high-precision probing of semiconductor devices in academic and industrial applications. The equipment is engineered to investigate a variety of materials ranging from silicon wafers to advanced 3D structures, including integrated circuit designs and MEMS sensors. The prober is equipped with a wide variety of probing, testing, and analysis capabilities to cover the entire testing process from development to production. The prober is comprised of a high-precision probe positioning system, an x-y stage for alignment, and a motorized z stage for post-processing. This unit is supported by powerful software that features statistical data analysis and test pattern generation, as well as CAD database management, design optimization, and automated testing. The machine offers automated wafer alignment and probing with an accuracy of up to 100 nanometers, and a movable working area with a total of 238 x 46 mm. The prober also offers a variety of features for optimal performance. These include a built-in multi-programmable sampling memory, automatic individual-die dynamic compensation and linearity corrections, automatic scratch detection, and automatic pass/fail analysis. Furthermore, it has integrated wide-area omni-directional alignment lens and a wide-area laser probing tool toallow quick and accurate testing of wafers up to 10 inches in diameter. TSK UF200SA is well-suited for metalization studies, active device characterization, die-level leakage current measurements, and a variety of semiconductor device testing and analysis tasks. It provides users with high-precision probing and testing, fast alignment, and excellent repeatability for accurate data acquisition. Furthermore, its modular design makes it easy to configure and can be easily expanded to meet changing requirements.
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