Used ACCRETECH / TSK UF 200SA #9312466 for sale

ACCRETECH / TSK UF 200SA is a prober developed by the Taiwanese engineering and technology company TSK, Inc. This prober is designed to maximize test throughput and reduce probing costs in wafer probing, as well as testing packaged devices, substrates, and die. In wafer probing, TSK UF200SA offers high-precision performance and can probe up to 13,500 wafers per hour. ACCRETECH UF 200 SA features a compact design that features an integrated motion platform and probe head. This allows for high speed and accuracy due to the reduced distances between the motion platform and the probing location. The motion platform includes 8 axes, providing high speeds of up to 1.2 m/sec per axis and accelerations up to 3.5 m/s2. This allows for rapid acceleration and a low loss of accuracy when probing. The prober is equipped with a high-precision capacitive displacement measurement and correction system, allowing for high accuracy wafer probing with an SD deviation of 0.3 micron. In order to achieve the highest possible accuracy and repeatability, the UF 200EM provides the option of static and dynamic temperature compensation. This is complemented by a range of dust prevention and environmental isolation options, ensuring high levels of performance in challenging environments. ACCRETECH / TSK UF200SA also provides a range of options that can be customized to suit the application. These include various handle and chuck types, probe card and IC handle configurations, manual and automatic indexing, and a wide range of other features. The system also includes software that allows for data management, program editing, and automation control. UF 200 SA is a high-performance prober that provides tremendous throughput, accuracy, and repeatability without compromising on speed or cost. It provides a range of customizations and features that make it suitable for a wide range of applications, making it an ideal tool for wafer probing and packaged device testing.