Used ACCRETECH / TSK UF 300 #293763792 for sale

ACCRETECH / TSK UF 300 prober is a semiconductor wafer prober designed for probing small wafers, which measure up to 300 mm in diameter. It is an integrated testing platform capable of testing small wafers with a variety of sensors and probes. The prober is equipped with a dual-telecentric optics equipment, a 4- position stage loading system, an advanced vibration isolator, a microstepping linear/ rotary stage, and a high speed multiplexer. TSK UF 300 prober also incorporates a real-time automated wafer-to-fixture alignment unit, allowing for precise sample alignment. The prober is designed to support a wide range of wafer-to-fixture testing. It offers an integrated solution for both optically aligning and physically probing small wafers. The prober is equipped with an optical microscope and soft compensation, which allow for alignment of a wafer to within a few nanometers of its intended location. The automated alignment machine can quickly and accurately align probes to wafer maps with high repeatability, providing users with a cost- effective solution to test small wafers with precision. ACCRETECH UF300 prober also features a vibration-resistant design, with a dedicated vibration motor and vibration isolator to ensure optimal performance. The tool utilizes a software-controlled isolation asset, ensuring that any vibrations generated during testing are accurately isolated. This helps ensure that the prober is able to probe small wafers without distorted results. The prober is also equipped with a automatic front-end loading model, which can transport up to four wafers at a time. This helps improve efficiency and reduce downtime. It is also equipped with a multiplexer, which enables users to switch between test configurations quickly and accurately. TSK UF300 prober offers superior performance and reliability, making it an excellent solution for testing small wafers. Its advanced features and capabilities enable users to quickly and accurately test small wafers with precision and repeatability.