Used ACCRETECH / TSK UF 300 #9252343 for sale

TSK/Toshiba Kokusai Electric ACCRETECH / TSK UF 300 is a prober, developed for the use in failure analysis, semiconductor testing, and process development. It is designed for electrical performance analysis in wafer probing applications, featuring high-speed operation, high-precision operations, and dynamic operation. TSK UF 300 features a wide range of operational modes to accurately analyze electrical signals in a variety of probing applications. A built-in fly-by contact ability supports short probing times by avoiding unnecessary redirections and supporting contact over larger distances. The prober is equipped with an algorithm for maintaining contact during motion, ensuring stable contact between the probe and the wafer. The high-precision, high-speed operation of ACCRETECH UF300 is a result of its use of a high-accuracy robot and a precision needle positioning system. The robot employed for UF 300 is built with high-precision bearings, providing repeatability with high accuracy. The needle positioning system enables the prober to accurately detect the edge of the wafer, providing precision positioning and laser-precise operation. TSK UF300 is designed with a flexible set of mounting options, ranging from manual tray-based to fully automated systems. An Original Mounting System (OMS) is used to securely position and mount the probe onto the prober. This OMS is manufactured with high-tolerance precision to ensure the mechanical accuracy of the prober and reduce the heating effect from external influences. ACCRETECH / TSK UF300 is also equipped with a range of special functions. These include a micro-step movement, thermal power control, automatic substrate size detection, automatic guide plate detection, and a wafer defect scan. The micro-step movement allows for the quick probing of small contacts and spots. The thermal power control allows users to set the probe temperature to prevent thermal damage to the wafer. The automatic substrate size detection ensures the prober accurately identifies the precise size of the wafer while the automatic guide plate detection automatically detects the wafer's guide plate. Lastly, the wafer defect scan detects abnormal defect on the wafer surface, providing a warning signal and increasing accuracy. In short, ACCRETECH/Toshiba Kokusai Electric UF300 is a high-precision, high-speed prober with a range of special functions that enables accurate, repeatable probing of semiconductor wafers. ACCRETECH UF 300's use of high-precision robots, precision needle positioning systems, and a range of other features makes it an ideal choice for failure analysis, semiconductor testing, and process development.